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The PCB is designed with an overhang around the base surface, depending on the component size. The percentage overhang is selected to minimize the thermal impact within the board (see image). The simulation assumes an installation setup without external ventilation (free convection). The voltage drop at connection points and, if application, plug connections is considered constant over the entire runtime. Chemical or mechanical damage to the contact points is not considered. The maximum temperature within the terminal block is evaluated.

Cyclic heating data is filtered to simplify processing. The model captures the upper limit of the maximum component temperatures, which is the critical value for assessment. The initial heating phase in the first cycle is not directly mapped but can be approximated by the difference between ambient temperature and the Y-axis intercept.

Please be advised that the technical solution proposed by WAGO, as well as any related information, are non-binding recommendations only, and no legal obligations (of any kind) shall be recognized or created. Our recommendations do not relieve the customer of their responsibility to verify the suitability for the specific application, as well as compliance with all legal requirements and relevant standards (including the generally recognized rules of technology). Additionally, please note that the consulting provided by WAGO is a voluntary service – any further success of the consulting service is expressly not guaranteed. Accordingly, our liability is excluded to the greatest extent permissible under the applicable law.